Double-sided silver sintering replaces aluminum wire bonding and becomes the mainstream of the future!


1. Characteristics of double-sided sintering technology

Double-sided sintering technology.png

1, improve the overcurrent ability, play the ability of SiC chip;

2, improve power cycle reliability;

3, effectively improve the heat dissipation capacity under high junction temperature.

Second, the use of pre-coated sintered silver copper foil to replace the original aluminum wire bonding, providing copper wire/copper strip bonding solution

 

In all the current interconnection solutions, double-sided silver sintering technology is the best choice for high-power modules, Shenzhen Xinyuan New Materials Co., LTD., as the only domestic supplier of the car, launched the PA-300A03 sintered copper electrode to help customers make silicon carbide modules using double-sided silver sintering technology. The use of sintered copper electrode can replace the original aluminum wire bonding, provide a new solution of copper wire/copper strip bonding, significantly improve the power module's overcurrent capacity and power cycle times, and use the core source PA-100A03A chip grade silver paste on the bare copper DBC/AMB sintering chip, effectively improve the customer's high junction temperature heat dissipation capacity, reduce customer costs.

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