What is the difference between non-pressure sintered silver and general conductive silver glue?


First, sintering temperature is different

Sintered silver is sintered through the unique surface energy of nano-silver particles, which can be heated to 160℃ in an ordinary oven without any pressure. Ordinary conductive silver glue can cure at lower temperatures;

Sintered silver.png

Second, the reliability is different

Sintered silver cold and hot cycle (-65~150℃)1000 times before failure; Ordinary conductive silver glue can only withstand 200 hot and cold cycles;

Sintered silver without pressure.png

Three, different thermal conductivity

The thermal conductivity of sintered silver without pressure can easily reach a thermal conductivity greater than 100W/m.K, while the thermal conductivity of ordinary conductive silver glue is only 5-20W/m.K.

Fourth, the bonding device is different

Sintered silver generally bonds high-power devices, such as third-generation semiconductors, high-power leds, RF devices, etc. The general conductive silver adhesive is bonded to the common first-generation integrated circuit package, and the interface requiring little electrical and thermal conductivity effect is not high.

For high-power chip packaging, pressureless sintered silver has great advantages over traditional interconnection solutions.

Related News


How to identify genuine and fake three terminal switch power supply chips

For many years, the electronic market has been plagued by a mix of good and bad, with shoddy products being passed off as good and fake products being used as fake. Many manufacturers have suffered greatly from this situation. So, how can we distinguish the authenticity of a three terminal switching power supply chip? There are generally three types of so-called fake chips: one is disassembled, one is refurbished, and one is leaked without QC. So how to distinguish?


Embedded intelligent furniture wireless charger solution

With the continuous advancement of technology, the chargers people use in their daily lives are also improving. From wired chargers in the past to wireless chargers now, we cannot help but marvel at the development of technology!


Can a variable frequency power supply be driven by a power supply chip due to unstable voltage and different frequencies?

The power drive chip variable frequency power supply is used by export electrical manufacturers to simulate the power grid conditions of different countries, providing engineers with pure and reliable sine wave power output with low harmonic distortion, high stability frequency, and voltage stabilization rate for product testing


PCIM Review -- core source new material inventory

The 2023 PCIM Asia Shanghai International Power Components and Renewable Energy Management Exhibition was held at the Shanghai New International Expo Center on August 31. Industry elites from consumer electronics, industrial electronics, automotive electronics, super power applications, smart home, renewable energy management and other fields gathered to explore the latest trends and innovative development of the industry.


National third generation semiconductor technology Innovation Center R & D and industrialization base project enterprise headquarters project completed delivery

The completion of the national third generation semiconductor technology innovation center R & D and industrialization base project enterprise headquarters project belongs to Dushu Lake Science and Education District, south of Qihui Road, west of Guangxian Street, a total area of about 26,000 square meters, a total construction area of about 92,000 square meters, a total investment of about 420 million yuan, a total of 3 R & D buildings and 1 plant planning.


What is the difference between non-pressure sintered silver and general conductive silver glue?

Sintered silver is sintered through the unique surface energy of nano-silver particles, which can be heated to 160℃ in an ordinary oven without any pressure. Ordinary conductive silver glue can cure at lower temperatures;