What is the difference between non-pressure sintered silver and general conductive silver glue?
Release Time:
2021-11-12 11:03
Source:
First, sintering temperature is different
Sintered silver is sintered through the unique surface energy of nano-silver particles, which can be heated to 160℃ in an ordinary oven without any pressure. Ordinary conductive silver glue can cure at lower temperatures;
Sintered silver.png
Second, the reliability is different
Sintered silver cold and hot cycle (-65~150℃)1000 times before failure; Ordinary conductive silver glue can only withstand 200 hot and cold cycles;
Sintered silver without pressure.png
Three, different thermal conductivity
The thermal conductivity of sintered silver without pressure can easily reach a thermal conductivity greater than 100W/m.K, while the thermal conductivity of ordinary conductive silver glue is only 5-20W/m.K.
Fourth, the bonding device is different
Sintered silver generally bonds high-power devices, such as third-generation semiconductors, high-power leds, RF devices, etc. The general conductive silver adhesive is bonded to the common first-generation integrated circuit package, and the interface requiring little electrical and thermal conductivity effect is not high.
For high-power chip packaging, pressureless sintered silver has great advantages over traditional interconnection solutions.
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What is the difference between non-pressure sintered silver and general conductive silver glue?
Sintered silver is sintered through the unique surface energy of nano-silver particles, which can be heated to 160℃ in an ordinary oven without any pressure. Ordinary conductive silver glue can cure at lower temperatures;