Hynix eMCP (Embedded Multi-Chip Package)
Hynix eMCP (Embedded Multi-Chip Package) is a high-quality memory solution that integrates
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Hynix
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Hynix eMCP (Embedded Multi-Chip Package) is a high-quality memory solution that integrates eMMC (Embedded Multimedia Card) and LPDDR (Low Power Double Data Rate) DRAM into a single package. This advanced technology offers several benefits, including smaller form factor, higher performance, and lower power consumption. Hynix eMCP is a reliable and efficient memory solution that offers enhanced performance, smaller size, and lower power consumption for a wide range of mobile and embedded applications.
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Contact: Gary Siak
Address:51 Ubi Ave 3, Level 3, Far East Group Building Singapore 408858